YCS Universal Mobile Phone CPU BGA Stencil Planting U-Platform
$ 9.04
Description
Specifications:
| Gross weight | 155g |
| Brands | YCS |
YCS Universal Mobile Phone CPU BGA Stencil Planting U-Platform
Features
1. Tight clamping, precise clamping, more stable operation, less likely to damage the chip.
2. High temperature and corrosion resistance, high quality synthetic stone, high strength, anti-fouling and easy to clean.
3. Glue removal, tin implantation, U protection, a good machine multi-purpose, magnetic design, stable and firm, high temperature resistance, durable.
4. Anti-slip rubber foot pads, wear-resistant and anti-slip, enhanced stability, easier maintenance.
Product Parameters
Name: YCS Repairer U-Platform
Size: 85x60x19mm
Function: degumming, detinning, U-table
Gross weight: 97g
Material: synthetic stone
Additional information
| Weight | 155 g |
|---|
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